Method and manufacturing system of producing microelectronic components with a layer structure
A method of producing microelectronic components includes forming a functional layer system; applying a laminar carrier to the functional layer system; attaching a workpiece to a workpiece carrier; utilizing incident radiation of a laser beam is focused in a boundary region between a growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed; separating a functional layer stack from the growth substrate, wherein a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, a negative pressure is generated in the inner region such that separation of the functional layer stack from the growth substrate is initiated in the inner region; and the growth substrate held on the vacuum gripper is removed from the functional layer stack.
1. A manufacturing system that produces microelectronic components that comprise a carrier and a microelectronic functional layer system applied to the carrier, the system comprising:
a workpiece carrier that accommodates a workpiece in the form of a layered composite comprising a carrier, a functional layer system bonded to the carrier, and a growth substrate bonded to the functional layer system;
a laser treatment station for incident radiation of a laser beam from a reverse side of the growth substrate through said growth substrate such that the laser beam is focused in a boundary region between the growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system is weakened or destroyed in the boundary region;
a debonding station that separates a functional layer stack comprising the carrier and the functional layer system from the growth substrate,
wherein
the debonding station comprises a vacuum gripper comprising a raised edge that defines a sealing zone and circumferentially encloses an area including a recess, wherein the vacuum gripper is configured to be applied to a reverse side of the growth substrate such that the area can be sealed from the exterior by the sealing zone, in the area, a clearance is provided between the vacuum gripper and the workpiece, and the vacuum gripper is in contact with the growth substrate along the raised edge and not in contact with the substrate in the area including the recess, and
devices that generate a negative pressure in the inner region are provided in the vacuum gripper which is applied to the workpiece.
2. The manufacturing system as claimed in claim 1 , wherein the vacuum gripper further comprises a pot-shaped main body with a closed circumferential raised edge, and a circumferential seal of rubber or silicone is arranged on an end face of said edge.
3. The manufacturing system as claimed in claim 1 , wherein the workpiece carrier is configured as a vacuum tensioning device having a sealing zone that circumferentially encloses an inner region, and the workpiece can be applied to the workpiece carrier such that contact with said workpiece carrier is only established in the region of the sealing zone and a negative pressure can be generated in the inner region.
4. The manufacturing system as claimed in claim 1 , wherein the workpiece carrier comprises a pot-shaped main body, incorporating a recess enclosed by a raised edge.
5. The manufacturing system as claimed in claim 1 , wherein the workpiece carrier incorporates an integrated heating device for the heat-up of the workpiece carried by the workpiece carrier.
6. The manufacturing system as claimed in claim 5 , wherein the heating device comprises an electrically-heatable and metallic body having an open pore structure and/or fluid ducts, and said body is inserted in a recess of a pot-shaped main body of the workpiece carrier.