Patent Assignment
Reel/Frame 059110/0807
Corrective Assignment to Correct the the Third Inventors Name Previously Recorded at Reel: 058847 Frame: 0851. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2022-02-15
Pages: 5
Assignors
ALBERT, SVEN
Executed: 2019-11-04
BOETTCHER, RENÉ
Executed: 2019-11-04
BÖHM, ALEXANDER
Executed: 2019-11-04
LINDNER, MIKE
Executed: 2019-11-04
SCHMIDT, THOMAS
Executed: 2019-09-27
Assignee
3D-MICROMAC AG
TECHNOLOGIE-CAMPUS 8, CHEMNITZ, 09126, GERMANY
Covered Property
(1)
Method and Manufacturing System of Producing Microelectronic Components with a Layer Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.