IP Library › Assignment 058967/0142
Patent Assignment
Reel/Frame 058967/0142

Assignment of Assignor's Interest

Recorded: 2022-02-10 Pages: 4
Assignors
PENG, CHIH-WEI
Executed: 2022-01-19
HSU, CHIH-CHUNG
Executed: 2022-02-05
WU, CHIH-CHUNG
Executed: 2022-02-09
CHUANG, ZUON-MIN
Executed: 2022-02-09
Assignee
OCP ASIA, INC.
NO. 26, INDUSTRY EAST 4 RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 30077, TAIWAN
Covered Property (1)
Package Structure Having Photonic Integrated Circuit
Application: 17/395,496 →
Publication: US 2022/0050245
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 7, 2022
From: OCP ASIA, INC.
To: MOLEX, LLC
Reel/Frame 059190/0289 →