IP Library › Assignment 059190/0289
Patent Assignment
Reel/Frame 059190/0289

Assignment of Assignor's Interest

Recorded: 2022-03-07 Pages: 3
Assignor
OCP ASIA, INC.
Executed: 2022-02-25
Assignee
MOLEX, LLC
2222 WELLINGTON COURT, LISLE, ILLINOIS, 60532
Covered Property (1)
Package Structure Having Photonic Integrated Circuit
Application: 17/395,496 →
Publication: US 2022/0050245
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 10, 2022
From: PENG, CHIH-WEI; HSU, CHIH-CHUNG; WU, CHIH-CHUNG; CHUANG, ZUON-MIN
To: OCP ASIA, INC.
Reel/Frame 058967/0142 →