Package structure having photonic integrated circuit
The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.
1. A package structure, comprising:
a substrate;
a chip which has an optical waveguide structure and an optical module recessed portion, the optical waveguide structure being adjacent to the optical module recessed portion, the optical module recessed portion facing the substrate, the chip being engaged to the substrate by flip chip; and
an optical module which is provided in the optical module recessed portion of the chip, wherein the optical module comprises a light source and a lens, the light source generates a light that passes through the lens and is emitted to the optical waveguide structure that is enclosed in the chip, and wherein an optical path of the light is located on a plane that is substantially parallel to the substrate, and a first electrical signal path of the optical module is different from a second electrical signal path of the chip,
wherein the chip is connected with an optical waveguide connection assembly, the substrate has an optical waveguide connection assembly recessed portion, and the optical waveguide connection assembly extends into the optical waveguide connection assembly recessed portion; and
wherein the optical waveguide connection assembly is connected with the chip in form of being suspended, to make the optical waveguide connection assembly separate from the substrate.
2. The package structure of claim 1 , wherein the substrate has an optical module recessed portion, and the optical module extends into the optical module recessed portion.
3. The package structure of claim 1 , wherein the light is incident to the optical waveguide structure along the optical path of an L shape via the lens.
4. The package structure of claim 1 , wherein the chip is a flip-chip type photonic integrated circuit.
5. The package structure of claim 1 , wherein the optical waveguide connection assembly comprises a first section and a second section connected with the first section, the first section being disposed on a top surface of the chip, and the second section extending into the optical waveguide connection assembly recessed portion along a side surface of the chip and separating from the substrate.
6. An optical device, configured to be connected with a chip that is engaged to a substrate;
wherein the optical device comprises:
a light source;
a lens, wherein the light source generates a light that passes through the lens and is emitted to an optical waveguide structure that is enclosed in the chip, and wherein an optical path of the light is located on a plane that is substantially parallel to the substrate, and a first electrical signal path of the optical device is different from a second electrical signal path of the chip; and
an optical waveguide connection assembly, configured to be connected with the chip, wherein the optical waveguide connection assembly extends into an optical waveguide connection assembly recessed portion of the substrate, and wherein the optical waveguide connection assembly is connected with the chip in form of being suspended, to make the optical waveguide connection assembly separate from the substrate.
7. The optical device of claim 6 , wherein the light is incident to the optical waveguide structure along the optical path of an L shape via the lens.
8. The optical device of claim 7 , wherein the light is emitted to an optical fiber connected with the chip.
9. The optical device of claim 8 , wherein the light source is electrically connected with the substrate via the chip, wherein the chip is engaged to the substrate by flip chip.
10. A package structure, comprising:
a substrate;
a chip which has an optical waveguide structure and a first optical module recessed portion, the optical waveguide structure being adjacent to the recessed portion, the recessed portion facing the substrate, the chip being engaged to the substrate by flip chip; and
an optical module, comprising a light source and a lens, the light source generates a light that passes through the lens and is emitted to the optical waveguide structure that is enclosed in the chip, and wherein an optical path of the light is located on a plane that is substantially parallel to the substrate, and a first electrical signal path of the optical module is different from a second electrical signal path of the chip,
wherein the chip is connected with an optical waveguide connection assembly, the substrate comprises an optical waveguide connection assembly recessed portion and a second optical module recessed portion, the optical waveguide connection assembly extends into the optical waveguide connection assembly recessed portion, and the optical waveguide connection assembly recessed portion and the second optical module recessed portion are communicated with each other.
11. The package structure of claim 10 , wherein the optical waveguide connection assembly recessed portion is at least partially disposed outside a region on the substrate where the substrate overlaps with the chip, and the second optical module recessed portion is at least partially disposed in a region on the substrate where the substrate overlaps with the recessed portion of the chip.