Media adaptor for multimode waveguide interconnects
Example implementations described herein involve a media adaptor configured to provide electrical/optical and optical/electrical conversion for a multi-mode waveguide (MMWG) interconnect, the media adaptor involving one or more ball grid arrays; and a tail-cut fiber array block (tcFAB) connected to a first array of photodiodes and a second array of laser diodes from direct optical wire (DOW) bonding.
1. A media adaptor configured to provide electrical/optical and optical/electrical conversion for a multi-mode waveguide (MMWG) interconnect, the media adaptor comprising:
one or more ball grid arrays; and
a tail-cut fiber array block (tcFAB) connected to a first array of photodiodes and a second array of laser diodes from direct optical wire (DOW) bonding,
the one or more ball grid arrays comprising a dummy ball grid array connecting the media adaptor to a printed circuit board via solder to align the first array of photodiodes and the second array of laser diodes connected to the tcFAB from DOW bonding to at least one MMWG of the MMWG interconnect embedded in the printed circuit board.
2. The media adaptor according to claim 1 , wherein the one or more ball grid arrays comprises a signal ball grid array connecting the media adaptor to a chip, wherein fibers of the tcFAB are connected to the signal ball grid array via electrical bonding, and wherein the chip is electrically connected to the signal ball grid array.
3. The media adaptor according to claim 1 , further comprising a transmitter chip and a receiver chip;
wherein the first array of photodiodes is connected to the receiver chip and the second array of laser diodes is connected to the transmitter chip.
4. The media adaptor of claim 3 , wherein the tcFAB is disposed on a substrate, wherein the receiver chip and the transmitter chip are on an opposite side of the substrate of the tcFAB.
5. The media adaptor of claim 3 , wherein the tcFAB is disposed on a substrate, wherein the receiver chip and the transmitter chip are disposed under the tcFAB on a same side of the substrate as the tcFAB.
6. The media adaptor of claim 3 , wherein the tcFAB is disposed on a substrate, wherein the receiver chip and the transmitter chip are disposed on the same side of the substrate as the tcFAB.