Optical interconnection assemblies, glass interconnection substrates, and methods of making an optical connection
Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion.
1. A method of making an optical connection between a substrate optical waveguide comprising an end surface and a chip optical waveguide of an optical chip comprising an end surface, the chip optical waveguide terminating at the end surface of the chip and the method comprising:
compressing a glass interconnection substrate such that a first end and a second end of the glass interconnection substrate are moved toward one another, wherein the glass interconnection substrate comprises:
a curved portion disposed between the first end and the second end; and
an optical waveguide at least partially positioned within the curved portion; and
positioning a first end surface of the first end of the glass interconnection substrate against the end surface of the optical waveguide and positioning a second end surface of the second end of the glass interconnection substrate against the end surface of the optical chip.
2. The method of claim 1 , wherein the substrate optical waveguide, the glass interconnection substrate, and the optical chip are mechanically coupled to a base substrate.
3. The method of claim 1 , wherein the glass interconnection substrate is secured to the substrate optical waveguide and the optical chip by an adhesive.
4. The method of claim 1 , further comprising adjusting a position of the glass interconnection substrate to align the optical waveguide of the glass interconnection substrate to the substrate optical waveguide and the chip optical waveguide.
5. The method of claim 1 , wherein:
at least one of a first end and a second end of the optical waveguide is offset from the first end surface and the second end surface of the glass interconnection substrate, respectively;
the method further comprises forming, using a laser, a laser written optical waveguide from at least one of the first end and the second end of the optical waveguide to the first end surface and the second end surface of the glass interconnection substrate, respectively; and
at least one of the substrate optical waveguide and the chip optical waveguide is optically coupled to the optical waveguide of the glass interconnection substrate by the laser written optical waveguide.
6. The method of claim 5 , wherein:
the first end of the glass interconnection substrate comprises a first planar surface and the second end of the glass interconnection substrate comprises a second planar surface; and
the laser written optical waveguide is formed by passing the laser through at least one of the first planar surface and the second planar surface.
7. The method of claim 1 , further comprising turning the second end of the glass interconnection substrate with respect to the first end such that a first plane defined by the first end surface of the first end is transverse to a second plane defined by the second end surface of the second end when the first end surface of the first end is positioned against the end surface of the optical waveguide and the second end surface of the second end is positioned against the end surface of the optical chip.
8. The method of claim 1 , wherein compressing the glass interconnection substrate comprises gripping one or more gripping features of the glass interconnection substrate with a gripping tool.
9. The method of claim 8 , wherein the one or more gripping features comprises one or more of a notch and a hole.
10. The method of claim 1 , wherein:
the substrate optical waveguide is one of a plurality of substrate optical waveguides;
the optical waveguide is one of a plurality of optical waveguides; and
the chip optical waveguide comprises a plurality of chip optical waveguides.