IP Library Granted Patent US 10,921,534
Granted Patent B2
US 10,921,534 · App. 16/692,041 · Granted Feb 16, 2021

Optical module structure and fabrication method for optical module structure

Inventors: Zhen Dong (Dongguan, CN); Jun Liu (Dongguan, CN); Li Zeng (Shenzhen, CN); Qing Zhao (Shenzhen, CN); Xiaolu Song (Shenzhen, CN)
Assignee: HUAWEI TECHNOLOGIES CO., LTD.
G02B6/4224G02B6/42G02B6/4245G02B6/4257G02B6/4228G02B6/4238G02B6/4269G02B6/4274
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Quick Facts
Patent No.
US 10,921,534
App. No.
16/692,041
Granted
Feb 16, 2021
Kind
B2
Abstract

An optical module structure includes a substrate, an optical chip and an electrical chip that are fixedly coupled to the substrate. The optical module structure further includes an optical coupling structure fixedly coupled to the optical chip. A side of the optical chip that faces the substrate has a first reference plane, and at least one first alignment mark is provided on the first reference plane. The optical coupling structure has a second reference plane, and at least one second alignment mark is provided on the second reference plane. The first reference plane is aligned with the second reference plane, and the first alignment mark is aligned with the second alignment mark.

Claims (15)

1. An optical module structure comprising:

a substrate;

an optical chip fixedly coupled to the substrate, wherein a first side of the optical chip facing the substrate comprises a first plurality of physical alignment marks on a first reference plane;

an electrical chip fixedly coupled to the substrate; and

an optical coupling structure fixedly coupled to the optical chip, wherein the optical coupling structure comprises a second plurality of physical alignment marks on a second reference plane, wherein the first plurality of physical alignment marks is aligned with the second plurality of physical alignment marks in an x-direction, and wherein the first reference plane is aligned with the second reference plane in a y-direction.

2. The optical module structure of claim 1 , wherein the optical coupling structure further comprises a first vertical plane perpendicular to the second reference plane, wherein the optical chip is optically coupled to the optical coupling structure, and wherein the first vertical plane is aligned with an end face on a second side of the optical chip facing the optical coupling structure.

3. The optical module structure of claim 2 , wherein the optical coupling structure and the optical chip are coupled using evanescent wave coupling, edge coupling, or vertical coupling.

4. The optical module structure of claim 3 , wherein the optical coupling structure and the optical chip are coupled using the evanescent wave coupling, wherein the optical coupling structure further comprises a first optical waveguide, wherein the optical chip comprises a second optical waveguide that is coupled to the first optical waveguide using the first reference plane and the second reference plane, wherein a first waveguide direction of the second optical waveguide at a coupling location faces the first vertical plane, and wherein a second waveguide direction of the first optical waveguide at the coupling location is parallel and opposite to the first waveguide direction.

5. The optical module structure of claim 3 , wherein the optical coupling structure and the optical chip are coupled using the edge coupling, wherein the optical coupling structure comprises a first optical waveguide, wherein the optical chip comprises a second optical waveguide that is coupled to the first optical waveguide using a first end face of the optical chip and the first vertical plane, wherein a first waveguide direction of the second optical waveguide at a coupling location faces the first vertical plane, and wherein a second waveguide direction of the first optical waveguide at the coupling location is parallel and opposite to the first waveguide direction.

6. The optical module structure of claim 3 , wherein the optical coupling structure and the optical chip are coupled using the vertical coupling, wherein the optical coupling structure comprises a first optical waveguide, wherein the optical chip comprises a second optical waveguide coupled to the first optical waveguide using the first reference plane and the second reference plane, wherein a first waveguide direction of the second optical waveguide at a coupling location faces the first vertical plane, and wherein a second waveguide direction of the first optical waveguide at the coupling location is perpendicular to the first reference plane and faces the first reference plane.

7. The optical module structure of claim 3 , wherein the optical coupling structure and the optical chip are coupled using the vertical coupling, wherein the optical coupling structure further comprises a first optical waveguide, wherein the optical chip comprises a second optical waveguide, and wherein the optical circuit structure further comprises a grating coupler disposed between the first optical waveguide and the second optical waveguide.

8. The optical module structure of claim 1 , wherein the optical chip and the electrical chip are located side by side on the substrate, and wherein the optical chip and the substrate are fixedly coupled in a same manner as the electrical chip and the substrate.

9. The optical module structure of claim 1 , further comprising a light source chip on the optical chip.

10. The optical module structure of claim 1 , further comprising a light source chip fastened on the first side of the optical chip, wherein the substrate comprises a first groove on a surface of the substrate facing the optical chip, and wherein the light source chip is located in the first groove.

11. The optical module structure of claim 1 , further comprising a heat dissipation structure located on sides of the optical chip and the electrical chip that are away from the substrate, and wherein the heat dissipation structure is in contact with the optical chip and the electrical chip.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2020
From: DONG, ZHEN; LIU, JUN; ZENG, LI; ZHAO, QING; SONG, XIAOLU
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 051545/0598 →
Continuity (2)
Continuation PCTCN2017085436 · May 23, 2017
Related Publication 20200096715A1 · Mar 26, 2020
Cited By (4)
US 12,332,490 US 12,442,994 US 12,470,041 US 12,554,079