IP Library Granted Patent US 10,948,658
Granted Patent B2
US 10,948,658 · App. 15/898,967 · Granted Mar 16, 2021

Optical interconnection assemblies, glass interconnection substrates, and methods of making an optical connection

Inventors: Chenueh Abongwa Florian Lohse (Berlin, DE); James Scott Sutherland (Corning, NY)
Assignee: Corning Optical Communications LLC
G02B6/305G02B6/1228G02B6/13G02B6/3839G02B6/4204G02B6/4227G02B6/4249H05K1/0274H05K1/181H05K2201/10121
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Quick Facts
Patent No.
US 10,948,658
App. No.
15/898,967
Granted
Mar 16, 2021
Kind
B2
Abstract

Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion.

Claims (137)

1. An optical interconnection assembly comprising:

a glass interconnection substrate comprising:

a first end and a second end;

a curved portion disposed between the first end and the second end; and

an optical waveguide extending from the first end to the second end and at least partially positioned within the curved portion,

wherein the glass interconnection substrate is flexible such that the first end is bendable with respect to the second end so that an end surface of the first end is non-parallel with respect to an end surface of the second end.

2. The optical interconnection assembly of claim 1 , wherein:

the optical waveguide is one of a plurality of optical waveguides;

the plurality of optical waveguides has a first pitch between individual optical waveguides at the first end;

the plurality of optical waveguide has a second pitch between the individual optical waveguides at the second end; and

the first pitch is different from the second pitch.

3. The optical interconnection assembly of claim 1 , wherein a thickness of the glass interconnection substrate at a point along a length of the glass interconnection substrate is less than a thickness of the glass interconnection substrate at the first end or the second end.

4. The optical interconnection assembly of claim 1 , wherein a depth of the optical waveguide within the glass interconnection substrate varies along a length of the glass interconnection substrate.

5. The optical interconnection assembly of claim 1 , wherein a depth of the optical waveguide within the glass interconnection substrate is such that the optical waveguide is closer to a convex surface of the glass interconnection substrate than a corresponding concave surface of the glass interconnection substrate.

6. The optical interconnection assembly of claim 1 , wherein at least a portion of the glass interconnection substrate is coated with a layer having an index of refraction between an index of refraction of air and an index of refraction of the glass interconnection substrate.

7. The optical interconnection assembly of claim 1 , wherein at least one of the first end and the second end of the glass interconnection substrate comprises a planar surface.

8. The optical interconnection assembly of claim 1 , wherein at least one of the first end and the second end comprise a first planar surface, a second planar surface, and a third planar surface.

9. The optical interconnection assembly of claim 1 , wherein a tip of at least one of the first end and the second end comprises a curved surface.

10. The optical interconnection assembly of claim 1 , wherein at least one of the first end and the second end has a stepped shape comprising an overhang portion.

11. The optical interconnection assembly of claim 1 , wherein a tip of at least one of the first end and the second end comprises a notch.

12. The optical interconnection assembly of claim 1 , wherein the curved portion comprises a first planar surface and a second planar surface.

13. The optical interconnection assembly of claim 12 , wherein the curved portion comprises a total internal reflection surface positioned between the first planar surface and the second planar surface.

14. The optical interconnection assembly of claim 1 , wherein an optical axis of the first end is in a first plane, an optical axis of the second end is in a second plane, and the first plane and the second plane are different.

15. The optical interconnection assembly of claim 1 , wherein the glass interconnection substrate comprises one or more gripping features.

16. The optical interconnection assembly of claim 15 , wherein the one or more gripping features are configured as grooves positioned at the first end or the second end.

17. The optical interconnection assembly of claim 15 , wherein the one or more gripping features comprise a first hole and a second hole at the first end and the second end.

18. The optical interconnection assembly of claim 17 , wherein the curved portion of the glass interconnection substrate further comprises a first perimeter notch and a second perimeter notch.

19. The optical interconnection assembly of claim 1 , further comprising at least one slot within the curved portion.

20. The optical interconnection assembly of claim 19 , wherein the at least one slot is curved.

21. The optical interconnection assembly of claim 19 , wherein the at least one slot extends from one of the first end and the second end.

22. The optical interconnection assembly of claim 1 , wherein:

the optical waveguide is one of a plurality of optical waveguides;

the glass interconnection substrate comprises a plurality of slots within the curved portion; and

an individual slot of the plurality of slots is adjacent one or more individual optical waveguides of the plurality of waveguides.

23. The optical interconnection assembly of claim 22 , wherein:

optical waveguides of the plurality of optical waveguides are curved; and

slots of the plurality of slots are curved.

24. The optical interconnection assembly of claim 22 , wherein the plurality of slots extend from an end surface of at least one of the first end and the second end and into the other of the first end and the second end.

25. The optical interconnection assembly of claim 22 , wherein the plurality of slots extend from an end surface of the first end and an end surface of the second end.

26. The optical interconnection assembly of claim 22 , wherein:

a first subset of the plurality of slots extends from an end surface of the first end and into the second end; and

a second subset of the plurality of slots extends from an end surface of the second end and into the first end.

27. The optical interconnection assembly of claim 1 , wherein:

an end surface of the first end of the glass interconnection substrate defines a first plane and an end surface of the second end of the glass interconnection substrate defines a second plane; and

the first plane is substantially parallel to the second plane.

28. The optical interconnection assembly of claim 1 , further comprising at least one alignment ridge extending from an upper surface of the glass interconnection substrate.

29. The optical interconnection assembly of claim 1 , further comprising at least one alignment waveguide extending through the bulk of the glass interconnection substrate.

30. The optical interconnection assembly of claim 1 , wherein:

an end surface of the first end of the glass interconnection substrate defines a first plane and an end surface of the second end of the glass interconnection substrate defines a second plane; and

the first plane is orthogonal to the second plane.

31. The optical interconnection assembly of claim 1 , wherein:

an end surface of the first end of the glass interconnection substrate defines a first plane and an end surface of the second end of the glass interconnection substrate defines a second plane; and

the first plane is transverse to the second plane.

32. The optical interconnection assembly of claim 31 further comprising:

a base substrate;

a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide comprising an end surface; and

an optical chip comprising an optical coupling surface.

33. The optical interconnection assembly of claim 32 , wherein:

the base substrate comprises a through-hole extending between a first surface of the base substrate and a second surface of the base substrate;

the first surface of the base substrate is opposite from the second surface of the base substrate;

the substrate optical waveguide is coupled to the first surface of the base substrate,

the optical chip is coupled to the second surface of the base substrate;

the optical chip comprises an active optical component disposed on a surface facing the through-hole;

a portion of the glass interconnection substrate is disposed within the through-hole of the base substrate; and

the first end of the glass interconnection substrate is coupled to the substrate optical waveguide and the second end of the glass interconnection substrate is coupled to the active optical component.

34. The optical interconnection assembly of claim 31 , wherein the glass interconnection substrate is continuously curved from an end surface of the first end to an end surface of the second end.

35. The optical interconnection assembly of claim 31 , wherein the glass interconnection substrate further comprises a first support block at the first end and a second support block at the second end.

36. The optical interconnection assembly of claim 31 , wherein:

the glass interconnection substrate comprises a first plurality of optical waveguides and a second plurality of optical waveguides;

the optical waveguide is one of the first plurality of optical waveguides or the second plurality of optical waveguides; and

the glass interconnection substrate further comprises at least one slot disposed between the first plurality of optical waveguides and the second plurality of optical waveguides.

37. The optical interconnection assembly of claim 31 , wherein:

the optical waveguide comprises a first optical waveguide and a second optical waveguide; and

the glass interconnection substrate further comprises at least one slot disposed between the first optical waveguide and the second optical waveguide.

38. The optical interconnection assembly of claim 31 , wherein the first end defines a first leg and the second end defines a second leg.

39. The optical interconnection assembly of claim 38 , wherein the glass interconnection substrate comprises a reflection surface between the first leg and the second leg.

40. The optical interconnection assembly of claim 38 , wherein the glass interconnection substrate comprising at least one alignment waveguide within at least one of the first leg and the second leg.

41. The optical interconnection assembly of claim 31 , wherein at least one of the first end and the second end of the glass interconnection substrate comprises a total internal reflection surface.

42. The optical interconnection assembly of claim 1 , wherein the curved portion comprises a first peak, a second peak and a valley disposed between the first peak and the second peak.

43. The optical interconnection assembly of claim 42 , further comprising:

a base substrate;

a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide comprising an end surface; and

an optical chip comprising an optical coupling surface.

44. The optical interconnection assembly of claim 43 , wherein:

the base substrate comprises a well comprising a recessed floor within a surface of the base substrate;

the optical chip at least partially covers the well;

the optical chip comprises a chip optical waveguide at a surface facing the well; and

the glass interconnection substrate is at least partially disposed within the well of the base substrate.

45. The optical interconnection assembly of claim 44 , wherein:

an optical coupling end of the optical waveguide is located at an upper surface of the glass interconnection substrate at the second peak; and

the optical coupling end of the optical waveguide is optically coupled to the chip optical waveguide.

46. The optical interconnection assembly of claim 45 , wherein a coupling of light between the optical coupling end of the at least one waveguide and the chip optical waveguide is in a direction substantially parallel to the optical chip.

47. The optical interconnection assembly of claim 44 , wherein the first end of the glass interconnection substrate contacts an end surface of the substrate optical waveguide, the second end of the glass interconnection substrate contacts a sidewall of the well, and an upper surface of the second peak of the glass interconnection substrate contacts the surface of the optical chip facing the well.

48. The optical interconnection assembly of claim 44 , wherein the substrate optical waveguide is one of a plurality of substrate optical waveguides, the optical waveguide is one of a plurality of optical waveguides, and the chip optical waveguide comprises a plurality of chip optical waveguides.

49. The optical interconnection assembly of claim 43 , wherein the curved portion comprises a loop, and an optical coupling end of the at least one waveguide is located at an upper surface of the loop.

50. The optical interconnection assembly of claim 1 , wherein:

the first end comprises a first end surface and the second end comprises a second end surface;

the glass interconnection substrate comprises an upper surface between the first end surface and the second end surface, and a lower surface between the first end surface and the second end surface;

the optical waveguide comprises an optical coupling end that is offset from one of the first end surface and the second end surface; and

the optical coupling end of the optical waveguide is located at one of the upper surface and the lower surface.

51. The optical interconnection assembly of claim 1 , wherein the glass interconnection substrate has a thickness in a range of about 50 μm and about 200 μm.

52. The optical interconnection assembly of claim 1 , wherein the optical waveguide comprises a pre-written waveguide at least partially within the curved portion, and at least one laser-written optical waveguide optically coupled to the pre-written waveguide and extending to at least one of the first end and the second end.

53. An optical interconnection assembly comprising:

a base substrate;

a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide comprising an end surface;

an optical chip comprising an optical coupling surface; and

a glass interconnection substrate comprising:

a first end optically coupled to the end surface of the substrate optical waveguide;

a second end optically coupled to the optical coupling surface of the optical chip;

a curved portion disposed between the first end and the second end; and

an optical waveguide extending from the first end to the second end and at least partially positioned within the curved portion,

wherein the glass interconnection substrate is flexible such that the first end is bendable with respect to the second end so that an end surface of the first end is non-parallel with respect to an end surface of the second end.

54. The optical interconnection assembly of claim 53 , wherein:

the substrate optical waveguide is one of a plurality of substrate optical waveguides;

the plurality of optical waveguides is optically coupled to the plurality of substrate optical waveguides at the first end of the glass interconnection substrate;

the optical chip comprises a plurality chip optical waveguides; and

the plurality of optical waveguides is optically coupled to the plurality of chip optical waveguides at the second end of the glass interconnection substrate.

55. The optical interconnection assembly of claim 53 , wherein:

at least one of the first end and the second end has a stepped shape comprising an overhang portion; and

the optical chip comprises an upper surface, and an underside surface of the overhang portion is disposed over the upper surface of the optical chip.

56. The optical interconnection assembly of claim 53 , wherein:

a tip of at least one of the first end and the second end comprises a notch; and

at least a portion of the notch is disposed at a lower surface of the optical chip.

57. The optical interconnection assembly of claim 53 , further comprising a spacer positioned between a surface of the base substrate and at least one of the first end and the second end of the glass interconnection substrate.

58. The optical interconnection assembly of claim 53 , further comprising a first glass block and a second glass block coupled to the glass interconnection substrate such that at least one of the first end and the second end of the glass interconnection substrate is disposed between the first glass block and the second glass block.

59. The optical interconnection assembly of claim 53 , further comprising an overhang portion disposed on the substrate optical waveguide such that at least a portion of the overhang portion extends beyond the end surface of the optical waveguide and is disposed over the at least one of the first end and the second end of the glass interconnection substrate.

60. The optical interconnection assembly of claim 53 , wherein the base substrate comprises a cutout, and one of the first end and the second end of the glass interconnection substrate is positioned within the cutout.

61. The optical interconnection assembly of claim 53 , wherein:

the second end of the glass interconnection substrate comprises a first surface, a second surface, and a second end surface between the first surface and the second surface;

the optical waveguide comprises a turn such that the optical waveguide terminates at the second surface;

the optical chip comprises an active optical component disposed on a first surface of the optical chip; and

the second surface of the glass interconnection substrate is coupled to the first surface of the optical chip such that the optical waveguide is optically coupled to the active optical component.

62. The optical interconnection assembly of claim 53 , wherein:

the second end of the glass interconnection substrate comprises a first surface, a second surface, and a second end surface between the first surface and the second surface;

the optical waveguide comprises a turn such that the optical waveguide terminates at the first surface;

the optical chip comprises an active optical component disposed on a second surface of the optical chip; and

the first surface of the glass interconnection substrate is coupled to the second surface of the optical chip such that the optical waveguide is optically coupled to the active optical component, and the second end of the glass interconnection substrate is disposed between the base substrate and the optical chip.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2018
From: LOHSE, CHENUEH ABONGWA FLORIAN; SUTHERLAND, JAMES SCOTT
To: CORNING OPTICAL COMMUNICATIONS LLC
Reel/Frame 044965/0453 →
Continuity (2)
Provisional Application 62464001 · Feb 27, 2017
Related Publication 20180246279A1 · Aug 30, 2018
Cited By (3)
US 12,332,490 US 12,504,655 US 12,560,771