Packaging with substrate and printed circuit board cutouts
An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.
1. An integrated circuit (IC) package, comprising:
a printed circuit board (PCB) having a cutout region;
a substrate disposed above the PCB, wherein the substrate comprises (i) a first cavity on a first surface of the substrate and (ii) a second cavity on the first surface of the substrate;
a first IC disposed on a second surface of the substrate and in the cutout region of the PCB;
a second IC disposed above the substrate; and
a first device disposed on the second IC and in the first cavity on the first surface of the substrate.
2. The IC package of claim 1 , further comprising a second device coupled to the second IC, wherein the second device is at least partially disposed in the second cavity.
3. The IC package of claim 2 , wherein the second device is an optical device or a fiber array unit (FAU).
4. The IC package of claim 2 , wherein the PCB further comprises a cavity disposed adjacent to the cutout region and below the second device.
5. The IC package of claim 1 , wherein the first device comprises a third IC.
6. The IC package of claim 1 , wherein the first device comprises a laser.
7. The IC package of claim 6 , further comprising a third IC disposed on the first surface of the substrate.
8. The IC package of claim 1 , further comprising a heat sink disposed on the first IC through the cutout region of the PCB.
9. A method for fabricating an integrated circuit (IC) package, comprising:
forming a printed circuit board (PCB) having a cutout region;
forming a substrate above the PCB, the substrate having at least (i) a first cavity on a first surface of the substrate and (ii) a second cavity on the first surface of the substrate;
forming a first IC on a second surface of the substrate and in the cutout region of the PCB;
forming a second IC above the substrate; and
forming a first device on the second IC and in the first cavity on the first surface of the substrate.
10. The method of claim 9 , further comprising forming a second device coupled to the second IC, wherein the second device is at least partially disposed in the second cavity.
11. The method of claim 10 , wherein the second device is an optical device or a fiber array unit (FAU).
12. The method of claim 10 , wherein forming the PCB further comprises forming a cavity adjacent to the cutout region and below the second device.
13. The method of claim 9 , wherein the first device comprises a third IC.
14. The method of claim 9 , wherein the first device comprises a laser.
15. The method of claim 14 , further comprising forming a third IC on the first surface of the substrate.
16. The method of claim 9 , further comprising forming a heat sink on the first IC through the cutout region of the PCB.
17. An optical transceiver module having a package comprising a plurality of integrated circuits (ICs), the package comprising:
a printed circuit board (PCB) having a cutout region;
a substrate disposed above the PCB, wherein the substrate comprises a first cavity on a top surface of the substrate;
a first IC of the plurality of ICs disposed on a bottom surface of the substrate and in the cutout region of the PCB;
a second IC of the plurality of ICs disposed above the substrate;
a third IC of the plurality of ICs disposed on the second IC and in the first cavity on the top surface of the substrate; and
an optical device coupled to the second IC.
18. The optical transceiver module of claim 17 , wherein:
the substrate further comprises a second cavity on the top surface of the substrate; and
the optical device is partially disposed in the second cavity.
19. The optical transceiver module of claim 17 , the package further comprising a heat sink disposed on the first IC through the cutout region of the PCB.
20. The optical transceiver module of claim 17 , wherein the PCB further comprises a cavity disposed adjacent to the cutout region and below the optical device.