IP Library Assignment 059246/0485
Patent Assignment
Reel/Frame 059246/0485

Assignment of Assignor's Interest

Recorded: 2022-03-11 Pages: 4
Assignors
CHAN, PHAIK YI
Executed: 2022-03-11
TEH, TING TING
Executed: 2022-03-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Modular Low Latency Electrical Sequence for Die-to-Die Interface
Application: 17/693,005 →
Publication: US 2022/0199573
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 9, 2025
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 072704/0307 →
Security Interest Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →