IP Library › Assignment 059407/0132
Patent Assignment
Reel/Frame 059407/0132

Assignment of Assignor's Interest

Recorded: 2022-03-28 Pages: 4
Assignors
AKIYOSHI, TOSHIYASU
Executed: 2022-03-24
MIYAHARA, MASANOBU
Executed: 2022-03-24
KAWAMATA, RYUTA
Executed: 2022-03-24
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Adhesive for Semiconductor, Production Method Therefor, and Semiconductor Device and Production Method Therefor
Application: 17/764,202 →
Publication: US 2022/0352116
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 10, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063280/0549 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →