Patent Assignment
Reel/Frame 059767/0024
Assignment of Assignor's Interest
Recorded: 2022-04-28
Pages: 4
Assignor
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Executed: 2022-04-26
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(3)
Methods and Apparatus for Processing a Substrate
Methods and Apparatus for Processing a Substrate
Machine Learning & Integrated Metrology for Run-to-Run Optimization of Chip-to-Wafer Alignment Accuracy
Application:
17/680,554 →
Publication:
US 2023/0274987
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 3, 2021
From: WU, MENGXUE; HOI, SIEW KIT; SOH, JAY MIN
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 056429/0685 →
Assignment of Assignor's Interest
Mar 17, 2022
From: LIANTO, PRAYUDI; SEE, GUAN HUEI; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 059292/0185 →
Assignment of Assignor's Interest
Mar 17, 2022
From: NARADIPA, MUHAMMAD AVICENNA; RUSYDI, ANDRIVO
To: NATIONAL UNIVERSITY OF SINGAPORE
Reel/Frame 059292/0405 →
Assignment of Assignor's Interest
Mar 28, 2022
From: WANG, RUIPING; WANG, SHIJING; NAHAS, SELIM
To: APPLIED MATERIALS, INC.
Reel/Frame 059411/0338 →
Assignment of Assignor's Interest
Mar 28, 2022
From: WANG, YING; SEE, GUAN HUEI
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 059411/0411 →