Patent Assignment
Reel/Frame 059780/0859
Assignment of Assignor's Interest
Recorded: 2022-05-02
Pages: 2
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Manufacturing Electronic Component Device and Electronic Component Device
Application:
17/768,746 →
Publication:
US 2024/0112941
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.