Patent Assignment
Reel/Frame 059947/0670
Assignment of Assignor's Interest
Recorded: 2022-05-18
Pages: 3
Assignor
UZOH, CYPRIAN EMEKA
Executed: 2022-02-25
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Structure with Conductive Feature and Method of Forming Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jan 30, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 062543/0264 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →