IP Library › Granted Patent US 12,211,809
Granted Patent B2
US 12,211,809 · App. 17/564,550 · Granted Jan 28, 2025

Structure with conductive feature and method of forming same

Inventor: Cyprian Emeka Uzoh (San Jose, CA)
Assignee: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
H01L24/05H01L24/03H01L24/08H01L2224/0311H01L2224/03848H01L2224/05647H01L2224/08145
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Quick Facts
Patent No.
US 12,211,809
App. No.
17/564,550
Filed
Dec 29, 2021
Granted
Jan 28, 2025
Kind
B2
Art Unit
2897
USPC
257/777
Abstract

An element is disclosed. The element can include a non-conductive structure having a non-conductive bonding surface, a cavity at least partially extending through a portion of a thickness of the non-conductive structure from the non-conductive bonding surface, and a conductive pad disposed in the cavity. The cavity has a bottom side and a sidewall. The conductive pad has a bonding surface and a back side opposite the bonding surface. An average size of the grains at the bonding surface is smaller than an average size of the grains adjacent the bottom side of the cavity. The conductive pad can include a crystal structure with grains oriented along a 111 crystal plane. The element can be bonded to another element to form a bonded structure. The element and the other element can be directly bonded to one another without an intervening adhesive.

Claims (47)

1. An element comprising:

a non-conductive structure having a non-conductive bonding surface;

a cavity at least partially extending through a portion of a thickness of the non-conductive structure from the non-conductive bonding surface, the cavity having a bottom side and a sidewall; and

a conductive pad disposed in the cavity, the conductive pad having a bonding surface and a back side opposite the bonding surface, wherein the bonding surface of the conductive pad is recessed below the non-conductive bonding surface and wherein_an average size of grains of the conductive pad at the bonding surface being smaller than an average size of the grains adjacent the bottom side of the cavity.

2. The element of claim 1 , wherein the non-conductive structure comprises a dielectric layer, and the non-conductive bonding surface of the non-conductive structure is prepared for direct bonding.

3. The element of claim 2 , wherein the conductive pad is a copper (Cu) pad.

4. The element of claim 3 , wherein the conductive pad includes a lower percentage of grains with vertically-oriented 111 crystal planes at the bonding surface compared with adjacent to the bottom side.

5. The element of claim 3 , wherein the conductive pad includes a higher percentage of grains with vertically-oriented 220 crystal planes at the bonding surface compared with adjacent to the bottom side.

6. The element of claim 1 , wherein the average size of the grains adjacent the bottom side of the cavity is at least 3 times greater than the average size of the grains at the bonding surface.

7. The element of claim 1 , wherein the average size of the grains adjacent the bottom side of the cavity is at least 20 times greater than the average size of the grains at the bonding surface.

8. The element of claim 1 , wherein the average size of the grains adjacent the bottom side of the cavity is between 0.2 microns (μm) to 1 μm.

9. The element of claim 1 , wherein the average size of the grains at the bonding surface is between 30 nanometer (nm) to 200 nm.

10. The element of claim 1 , further comprising a barrier layer disposed between the non-conductive structure and the conductive pad.

11. A bonded structure comprising:

a first element including;

a non-conductive structure having a non-conductive bonding surface;

a cavity extending at least partially through a thickness of the non-conductive structure from the non-conductive bonding surface, the cavity having a bottom side and a sidewall; and

a conductive pad disposed in the cavity, the conductive pad having a bonding surface and a back side opposite the bonding surface, wherein an average size of grains of the conductive pad at the bonding surface is different than an average size of the grains adjacent the bottom side of the cavity; and

a second element having a second conductive pad,

wherein the conductive pad of the first element and the second conductive pad of the second element are directly bonded to one another without an intervening adhesive along a bonding interface, wherein the second element comprises a second non-conductive bonding surface, wherein the non-conductive bonding surface is directly bonded to the second non-conductive bonding surface, and wherein at least one of the non-conductive bonding surface and the second non-conductive bonding surface comprises an activated bonding surface.

12. The bonded structure of claim 11 , wherein the second non-conductive bonding surface is directly bonded to the non-conductive bonding surface without an intervening adhesive.

13. The bonded structure of claim 11 , wherein the average size of the grains at the bonding interface is at least 50% greater than the average size of the grains adjacent the bottom side of the cavity.

14. The bonded structure of claim 11 , wherein the average size of the grains at the bonding interface is at least two times greater than the average size of the grains adjacent the bottom side of the cavity.

15. The bonded structure of claim 14 , wherein the average size of the grains at the bonding interface is at least three times greater than the average size of the grains adjacent the bottom side of the cavity.

16. The bonded structure of claim 11 , wherein the average size of the grains of the conductive pad at the bonding surface is at least 20% different than the average size of the grains adjacent the bottom side of the cavity.

17. The bonded structure of claim 16 , wherein the average size of the grains of the conductive pad at the bonding surface is at least 20% greater than the average size of the grains adjacent the bottom side of the cavity.

18. The bonded structure of claim 11 , wherein the activated bonding surface comprises a plasma-activated bonding surface.

19. The bonded structure of claim 11 , wherein the activated bonding surface comprises an amount of nitrogen that is indicative of nitrogen termination.

20. The bonded structure of claim 11 , wherein the activated bonding surface comprises a nitrogen-terminated inorganic non-conductive material.

21. The bonded structure of claim 11 , wherein the non-conductive bonding surface is directly bonded to the second non-conductive bonding surface with a covalent bond.

22. A method for forming an element, the method comprising:

providing a non-conductive structure having a first side and a second side opposite the first side;

forming a cavity in the non-conductive structure;

providing a conductive material in the cavity and on a portion of the first side of the non-conductive structure, the conductive material having a lower side facing a bottom side of the cavity and an upper side opposite the lower side;

cold working the upper side of the conductive material to modify a grain structure of the conductive material, wherein the cold working is conducted between about −196° C. and 50° C.; and

removing at least a portion of the conductive material to define a conductive pad having a conductive bonding surface.

23. The method of claim 22 , wherein the cold working comprises mechanical peening or laser peening.

24. The method of claim 22 , wherein the cold working comprises bombarding the upper side of the conductive material with metal particles, glass particles, or ceramic particles.

25. The method of claim 22 , wherein the cold working comprises decreasing a percentage of 111 crystal planes in the conductive material.

26. The method of claim 25 , wherein the cold working comprises inducing plastic deformation in the conductive material, and causing grain sizes of the conductive material at least at the upper side to be reduced compared to prior to the cold working.

27. The method of claim 22 , wherein the cold working produces smaller grains sizes at the upper side of the conductive material compared to at the lower side of the conductive material.

28. The method of claim 22 , further comprising annealing the conductive material to stabilize grain sizes of the conductive material prior to cold working.

29. The method of claim 22 , further comprising preparing the conductive bonding surface of the conductive pad and the first side of the non-conductive structure for direct bonding.

30. A method for forming a bonded structure, the method comprising bonding the element of claim 22 to a second element having a second non-conductive structure and a second conductive pad.

31. The method of claim 30 , wherein the bonding comprises directly bonding the non-conductive structure and the second non-conductive structure.

32. The method of claim 31 , wherein the bonding further comprises annealing the conductive pad and the second conductive pad at a temperature between 50°° C. and 250° C.

33. The method of claim 32 , wherein annealing the conductive pad and the second conductive pad causes an average grain size of the conductive material at the upper side to be larger as compared to prior to the annealing.

Assignments (3)
SECURITY INTEREST Recorded May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR SOLUTIONS LLC; ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
CHANGE OF NAME Recorded Jan 30, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 062543/0264 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2022
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 059947/0670 →
Continuity (2)
Provisional Application 63132334 · Dec 30, 2020
Related Publication 20220208702A1 · Jun 30, 2022
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