Patent Assignment
Reel/Frame 062543/0264
Change of Name
Recorded: 2023-01-30
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Structure with Conductive Feature and Method of Forming Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 18, 2022
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 059947/0670 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →