IP Library › Assignment 060185/0287
Patent Assignment
Reel/Frame 060185/0287

Assignment of Assignor's Interest

Recorded: 2022-06-13 Pages: 4
Assignors
LI, LEO
Executed: 2022-06-12
YEN, CHIH-JU
Executed: 2022-06-12
LO, JUI HSIEN
Executed: 2022-06-12
CHEN, CHIEN-SHENG
Executed: 2022-06-12
JENG, SHIN-PUU
Executed: 2022-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Package and Method of Manufacturing
Application: 17/806,311 →
Publication: US 2023/0402417
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the First Name of the First Inventor Previously Recorded at Reel: 060185 Frame: 0287. Assignor(S) Hereby Confirms the Assignment. Jul 20, 2022
From: LI, CHIEN; YEN, CHIH-JU; LO, JUI HSIEN; CHEN, CHIEN-SHENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060777/0164 →