Corrective Assignment to Correct the the First Name of the First Inventor Previously Recorded at Reel: 060185 Frame: 0287. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2022-07-20 Pages: 7

Assignors

LI, CHIEN

Executed: 2022-06-30

YEN, CHIH-JU

Executed: 2022-06-12

LO, JUI HSIEN

Executed: 2022-06-12

CHEN, CHIEN-SHENG

Executed: 2022-06-12

JENG, SHIN-PUU

Executed: 2022-06-12

Assignee

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Property (1)

Semiconductor Package and Method of Manufacturing

Patent: 12,476,213 →

Application: 17/806,311 →

Publication: US 2023/0402417

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.