Patent Assignment
Reel/Frame 060542/0606
Assignment of Assignor's Interest
Recorded: 2022-05-04
Pages: 2
Assignor
YASUKAWA, HIROHISA
Executed: 2018-07-20
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Semiconductor Device, Electronic Module and Electronic Apparatus Each Having Stacked Embedded Active Components in a Multilayer Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.