Patent Assignment
Reel/Frame 060542/0608
Change of Name
Recorded: 2022-05-04
Pages: 7
Assignor
SONY CORPORATION
Executed: 2021-04-01
Assignee
SONY GROUP CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Semiconductor Device, Electronic Module and Electronic Apparatus Each Having Stacked Embedded Active Components in a Multilayer Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.