IP Library › Assignment 060712/0564
Patent Assignment
Reel/Frame 060712/0564

Assignment of Assignor's Interest

Recorded: 2022-08-03 Pages: 3
Assignors
LIU, MING CHYI
Executed: 2022-06-22
LU, JIECH-FUN
Executed: 2022-07-10
HSU, HUNG-WEN
Executed: 2022-06-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Uniform Trenches in Semiconductor Devices and Manufacturing Method Thereof
Application: 17/810,498 →
Publication: US 2023/0230993
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 60712 Frame 564. Assignor(S) Hereby Confirms the Assignment. Jul 10, 2025
From: LIU, MING CHYI; LU, JIECH-FUN; HSU, HUNG-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 072005/0520 →