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Patent Assignment
Reel/Frame 072005/0520

Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 60712 Frame 564. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2025-07-10 Pages: 6
Assignors
LIU, MING CHYI
Executed: 2022-06-22
LU, JIECH-FUN
Executed: 2022-07-10
HSU, HUNG-WEN
Executed: 2022-06-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Uniform Trenches in Semiconductor Devices and Manufacturing Method Thereof
Application: 17/810,498 →
Publication: US 2023/0230993
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 3, 2022
From: LIU, MING CHYI; LU, JIECH-FUN; HSU, HUNG-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 060712/0564 →