IP Library › Assignment 060716/0306
Patent Assignment
Reel/Frame 060716/0306

Assignment of Assignor's Interest

Recorded: 2022-08-04 Pages: 12
Assignors
KOBAYASHI, SHINGO
Executed: 2022-04-26
MINAMI, HISATAKA
Executed: 2022-06-20
OTSUKA, YUYA
Executed: 2022-06-30
KOMINE, MAYUMI
Executed: 2022-06-15
WU, JENNA
Executed: 2022-06-15
TAKAHASHI, HISATO
Executed: 2022-06-15
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Cmp Polishing Liquid and Polishing Method
Application: 17/797,333 →
Publication: US 2023/0054199
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →