IP Library › Assignment 060772/0475
Patent Assignment
Reel/Frame 060772/0475

Assignment of Assignor's Interest

Recorded: 2022-08-10 Pages: 8
Assignors
HAQ, JESMIN
Executed: 2018-04-12
ZHONG, TOM
Executed: 2018-04-12
LAM, VINH
Executed: 2018-04-12
SUNDAR, VIGNESH
Executed: 2018-04-12
TENG, ZHONGJIAN
Executed: 2018-04-12
Assignee
HEADWAY TECHNOLOGIES, INC.
678 SOUTH HILL VIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
MTJ Device Performance by Adding Stress Modulation Layer to MTJ Device Structure
Application: 17/885,079 →
Publication: US 2022/0384713
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 10, 2022
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
Reel/Frame 060772/0590 →