Patent Assignment
Reel/Frame 060772/0590
Assignment of Assignor's Interest
Recorded: 2022-08-10
Pages: 20
Assignor
HEADWAY TECHNOLOGIES, INC.
Executed: 2019-02-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
MTJ Device Performance by Adding Stress Modulation Layer to MTJ Device Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.