Patent Assignment
Reel/Frame 060944/0789
Assignment of Assignor's Interest
Recorded: 2022-08-31
Pages: 4
Assignor
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Executed: 2022-08-26
Assignee
PANASONIC HOLDINGS CORPORATION
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Properties
(5)
Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
Package for Optical Semiconductor Device, Optical Semiconductor Device Using the Package, and Methods for Producing Same
Lead, Wiring Member, Package Part, Metal Part Provided with Resin and Resin-Sealed Semiconductor Device, and Methods for Producing Same
Optical Semiconductor Device Package, Optical Semiconductor Device, and Manufacturing Method for Optical Semiconductor Device Package
Package for Installing Semiconductor Element, and Semiconductor Device
Application:
17/178,684 →
Publication:
US 2021/0175399
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
Assignment of Assignor's Interest
Jul 28, 2020
From: FUKUNAGA, TAKAHIRO; KITTAKA, AKINOBU
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 053334/0363 →
Corrective Assignment to Correct the Erroneously Filed Application Numbers 13/384239, 13/498734, 14/116681 and 14/301144 Previously Recorded on Reel 034194 Frame 0143. Assignor(S) Hereby Confirms the Assignment.
Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
Assignment of Assignor's Interest
Jun 13, 2021
From: NIWA, IKUO; HASE, YASUTAKA; AKAI, SHUNSUKE; TAKAGI, HAYATO
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056524/0130 →