IP Library › Assignment 061308/0769
Patent Assignment
Reel/Frame 061308/0769

Assignment of Assignor's Interest

Recorded: 2022-10-04 Pages: 6
Assignor
PARK, JUNG SOO
Executed: 2022-09-26
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package and Manufacturing Method Thereof
Patent: 9,633,939 →
Application: 15/049,872 →
Publication: US 2016/0247767
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 2, 2016
From: KIM, SEE WON
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 038593/0860 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest Sep 28, 2022
From: KIM, DO HYUNG
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 061238/0714 →