Patent Assignment
Reel/Frame 061310/0047
Assignment of Assignor's Interest
Recorded: 2022-10-04
Pages: 2
Assignor
CHO, JAE WON
Executed: 2022-08-31
Assignee
ENGION CO., LTD.
94, GWAHAKSANEOP 3-RO, OCHANG-EUP, CHEONGWON-GU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, 28125, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Delamination Device and Control Method Therefor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.