IP Library › Assignment 071057/0385
Patent Assignment
Reel/Frame 071057/0385

Change of Name

Recorded: 2025-05-07 Pages: 3
Assignor
ENGION CO., LTD.
Executed: 2024-01-31
Assignee
ENGION, INC.
94, GWAHAKSANEOP 3-RO, OCHANG-EUP, CHEONGWON-GU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Properties (2)
Semiconductor Chip Delamination Apparatus Device
Application: 17/916,989 →
Publication: US 2023/0158790
Semiconductor Chip Delamination Device and Control Method Therefor
Application: 17/916,992 →
Publication: US 2023/0162997
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 4, 2022
From: CHO, JAE WON
To: ENGION CO., LTD.
Reel/Frame 061309/0888 →
Assignment of Assignor's Interest Oct 4, 2022
From: CHO, JAE WON
To: ENGION CO., LTD.
Reel/Frame 061310/0047 →
Merger May 13, 2025
From: ENGION, INC.
To: DOOSAN TESNA INC.
Reel/Frame 071103/0280 →