IP Library › Assignment 071103/0280
Patent Assignment
Reel/Frame 071103/0280

Merger

Recorded: 2025-05-13 Pages: 9
Assignor
ENGION, INC.
Executed: 2025-03-04
Assignee
DOOSAN TESNA INC.
72, SANDAN-RO 16BEON-GIL, PYEONGTAEK-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties (2)
Semiconductor Chip Delamination Apparatus Device
Application: 17/916,989 →
Publication: US 2023/0158790
Semiconductor Chip Delamination Device and Control Method Therefor
Application: 17/916,992 →
Publication: US 2023/0162997
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 4, 2022
From: CHO, JAE WON
To: ENGION CO., LTD.
Reel/Frame 061309/0888 →
Assignment of Assignor's Interest Oct 4, 2022
From: CHO, JAE WON
To: ENGION CO., LTD.
Reel/Frame 061310/0047 →
Change of Name May 7, 2025
From: ENGION CO., LTD.
To: ENGION, INC.
Reel/Frame 071057/0385 →