Patent Assignment
Reel/Frame 061310/0194
Assignment of Assignor's Interest
Recorded: 2022-10-04
Pages: 2
Assignors
KURODA, TAKAHIRO
Executed: 2022-09-27
TOMORI, NAOKI
Executed: 2022-09-27
NAGOYA, TOMOHIRO
Executed: 2022-09-29
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame Provided with Temporary Protective Film, Encapsulation Molded Body, and Method for Manufacturing Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.