Patent Assignment
Reel/Frame 061628/0618
Assignment of Assignor's Interest
Recorded: 2022-11-02
Pages: 3
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Production Method for Semiconductor Packages
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.