Patent Assignment
Reel/Frame 061713/0923
Assignment of Assignor's Interest
Recorded: 2022-10-19
Pages: 11
Assignors
MCELHINNY, KYLE
Executed: 2021-09-17
SHAN, BOHAN
Executed: 2021-09-19
FENG, HONGXIA
Executed: 2021-10-08
GUO, XIAOYING
Executed: 2021-09-24
SCHMITT, ADAM
Executed: 2021-09-24
VEHONSKY, JACOB
Executed: 2021-09-17
CHO, STEVE
Executed: 2021-09-27
ARANA, LEONEL
Executed: 2021-09-17
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Application:
17/484,519 →
Publication:
US 2023/0096835
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.