Patent Assignment
Reel/Frame 061773/0141
Change of Name
Recorded: 2022-10-26
Pages: 5
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(4)
Offset Pads Over Tsv
Processing Stacked Substrates
Metal Pads Over Tsv
Stacked Electronic Devices
Application:
63/263,203 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 20, 2021
From: LEE, BONGSUB; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 057531/0181 →
Assignment of Assignor's Interest
Jan 10, 2022
From: GUEVARA, GABRIEL Z.; HABA, BELGACEM; UZOH, CYPRIAN EMEKA; WORKMAN, THOMAS
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 058608/0348 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Assignment of Assignor's Interest
Apr 11, 2025
From: UZOH, CYPRIAN EMEKA; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 070813/0189 →