Patent Assignment
Reel/Frame 061839/0577
Assignment of Assignor's Interest
Recorded: 2022-11-21
Pages: 2
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Wiring Structure, Method for Manufacturing Same, and Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.