Patent Assignment
Reel/Frame 061898/0648
Change of Name
Recorded: 2022-11-08
Pages: 52
Assignor
HITACHI CHEMICAL CO., LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2 MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Slurry, Polishing-Liquid Set, Polishing Liquid, and Polishing Method for Base
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 23, 2020
From: MINAMI, HISATAKA; IWANO, TOMOHIRO; ARAKAWA, KEITA; HIDAKA, TAKAHIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053013/0743 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →