IP Library › Assignment 061947/0649
Patent Assignment
Reel/Frame 061947/0649

Assignment of Assignor's Interest

Recorded: 2022-12-01 Pages: 4
Assignors
MARGALIT, MORDEHAI
Executed: 2010-10-19
PETRONIUS, ISRAEL
Executed: 2010-10-19
Assignee
VIAGAN LTD.
21 HASHITA ST., ZICHRON YAAQOV, 30900, ISRAEL
Covered Properties (6)
Wafer Level Packaging of Electronic Devices
Patent: 9,406,854 →
Application: 13/424,875 →
Publication: US 2012/0261697
Light Emitting Diode Package with Enhanced Heat Conduction
Patent: 9,502,612 →
Application: 14/047,715 →
Publication: US 2014/0042479
Wafer Level Packaging of Electronic Devices
Application: 15/188,225 →
Publication: US 2016/0300991
LIGHT EMITTING DIODE PACKAGE with enhanced heat conduction
Application: 61/710,156 →
Light Emitting Diode Package with Enhanced Heat Conduction
Application: 90/015,091 →
Light Emitting Diode Package with Enhanced Heat Conduction
Application: 90/015,134 →
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 23, 2021
From: VIAGAN
To: LED WAFER SOLUTIONS LLC
Reel/Frame 055688/0361 →
Assignment of Assignor's Interest Dec 1, 2022
From: MARGALIT, MORDEHAI
To: VIAGAN LTD.
Reel/Frame 061947/0817 →
Assignment of Assignor's Interest Dec 1, 2022
From: PETRONIUS, ISRAEL
To: VIAGAN LTD
Reel/Frame 061947/0912 →