IP Library › Assignment 061947/0912
Patent Assignment
Reel/Frame 061947/0912

Assignment of Assignor's Interest

Recorded: 2022-12-01 Pages: 4
Assignor
PETRONIUS, ISRAEL
Executed: 2016-06-21
Assignee
VIAGAN LTD
21 HASHITA STREET, ZICHRON YAAKOV, 30900, ISRAEL
Covered Properties (3)
Wafer Level Packaging of Electronic Devices
Patent: 9,406,854 →
Application: 13/424,875 →
Publication: US 2012/0261697
Wafer Level Packaging of Electronic Devices
Application: 15/188,225 →
Publication: US 2016/0300991
LIGHT EMITTING DIODE PACKAGE with enhanced heat conduction
Application: 61/710,156 →
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 23, 2021
From: VIAGAN
To: LED WAFER SOLUTIONS LLC
Reel/Frame 055688/0361 →
Assignment of Assignor's Interest Dec 1, 2022
From: MARGALIT, MORDEHAI; PETRONIUS, ISRAEL
To: VIAGAN LTD.
Reel/Frame 061947/0649 →
Assignment of Assignor's Interest Dec 1, 2022
From: MARGALIT, MORDEHAI
To: VIAGAN LTD.
Reel/Frame 061947/0817 →