Patent Assignment
Reel/Frame 062180/0700
Assignment of Assignor's Interest
Recorded: 2022-12-22
Pages: 3
Assignors
MITSUKURA, KAZUYUKI
Executed: 2022-08-06
IMAZU, YUKI
Executed: 2022-08-06
AOKI, YU
Executed: 2022-09-09
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Method for Selecting Photosensitive Resin Composition, Method for Producing Patterned Cured Film, and Method for Producing Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.