Patent Assignment
Reel/Frame 062307/0516
Assignment of Assignor's Interest
Recorded: 2023-01-09
Pages: 3
Assignor
ZEYEN, BENEDIKT
Executed: 2012-05-13
Assignee
INNOVATIVE MICRO TECHNOLOGY, INC.
75 ROBIN HILL ROAD, GOLETA, CALIFORNIA, 93117
Covered Properties
(2)
Solder Bump Sealing Method and Device
Anodic Bonding of Dielectric Substrates
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044553/0257 →
Security Interest
Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: AGILITY CAPITAL II, LLC
Reel/Frame 044635/0492 →
Release of Security Interest
Oct 15, 2018
From: AGILITY CAPITAL II, LLC
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 047237/0141 →
Release of Security Interest
Jan 30, 2019
From: PACIFIC WESTERN BANK
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 048195/0441 →
Assignment of Assignor's Interest
Jan 9, 2023
From: PATIL, VIKRAM
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 062307/0558 →
Change of Name
Jan 9, 2023
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 063875/0342 →
Security Interest
Feb 23, 2023
From: ATOMICA CORP.
To: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
Reel/Frame 062841/0341 →
Release of Security Interest
Mar 12, 2025
From: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
To: ATOMICA CORP.
Reel/Frame 070485/0737 →