Patent Assignment
Reel/Frame 062342/0491
Assignment of Assignor's Interest
Recorded: 2023-01-11
Pages: 4
Assignors
YAN, YINGQIANG
Executed: 2022-12-08
WANG, YAO
Executed: 2022-12-08
HU, CHUAN
Executed: 2022-12-08
XIANG, XUN
Executed: 2022-12-08
CHEN, ZHITAO
Executed: 2022-12-08
Assignee
GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
363 CHANGXING ROAD, TIANHE DISTRICT, GUANGZHOU, 510000, CHINA
Covered Property
(1)
Chip Fine Line Fan-Out Package Structure and Manufacturing Method Therefor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Confirmatory License
Jun 15, 2023
From: IOWA STATE UNIVERSITY
To: US GOVERNMENT AS REPRESENTED BY THE SECRETARY OF THE ARMY
Reel/Frame 063995/0024 →
Assignment of Assignor's Interest
Dec 11, 2024
From: GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
To: SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD.
Reel/Frame 069553/0333 →