Assignment of Assignor's Interest

Recorded: 2024-12-11 Pages: 2

Assignor

Executed: 2024-12-04

Assignee

601, 6/F, BLOCK 2, ZHONGJIAN INDUSTRIAL BUILDING, NO. 18 YANSHAN ROAD, SHEKOU STREET, NANSHAN DISTRICT, SHENZHEN, 518067, CHINA

Covered Property (1)

Chip Fine Line Fan-Out Package Structure and Manufacturing Method Therefor

Patent: 12,575,432 →

Application: 18/015,576 →

Publication: US 2023/0253333

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.