Patent Assignment
Reel/Frame 063995/0024
Confirmatory License
Recorded: 2023-06-15
Pages: 2
Assignor
IOWA STATE UNIVERSITY
Executed: 2023-01-12
Assignee
US GOVERNMENT AS REPRESENTED BY THE SECRETARY OF THE ARMY
15 GENERAL GREENE AVE, NATICK, MASSACHUSETTS, 01760
Covered Property
(1)
Chip Fine Line Fan-Out Package Structure and Manufacturing Method Therefor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 11, 2023
From: YAN, YINGQIANG; WANG, YAO; HU, CHUAN; XIANG, XUN
To: GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
Reel/Frame 062342/0491 →
Assignment of Assignor's Interest
Dec 11, 2024
From: GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
To: SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD.
Reel/Frame 069553/0333 →