Patent Assignment
Reel/Frame 062553/0455
Assignment of Assignor's Interest
Recorded: 2023-01-31
Pages: 4
Assignors
GAO, GUILIAN
Executed: 2019-09-17
DELACRUZ, JAVIER A.
Executed: 2019-09-17
HUANG, SHAOWU
Executed: 2019-09-17
WANG, LIANG
Executed: 2019-09-18
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2019-09-18
KATKAR, RAJESH
Executed: 2019-09-17
UZOH, CYPRIAN EMEKA
Executed: 2019-09-18
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Bond Enhancement Structure in Microelectronics for Trapping Contaminants During Direct-Bonding Processes
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Feb 6, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 066507/0971 →