IP Library › Assignment 066507/0971

Patent Assignment

Reel/Frame 066507/0971

Change of Name

Recorded: 2024-02-06 Pages: 4

View PDF Order Certified Copy

Assignor

INVENSAS BONDING TECHNOLOGIES, INC.

Executed: 2022-08-15

Assignee

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134

Covered Property (1)

Bond Enhancement Structure in Microelectronics for Trapping Contaminants During Direct-Bonding Processes

Patent: 11,967,575 →

Application: 17/681,019 →

Publication: US 2022/0246564

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.

Assignment of Assignor's Interest Jan 31, 2023

From: GAO, GUILIAN; DELACRUZ, JAVIER A.; HUANG, SHAOWU; WANG, LIANG

To: INVENSAS BONDING TECHNOLOGIES, INC.

Reel/Frame 062553/0455 →

Security Interest May 3, 2023

From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.

To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT

Reel/Frame 063529/0272 →