IP Library › Assignment 062809/0328
Patent Assignment
Reel/Frame 062809/0328

Assignment of Assignor's Interest

Recorded: 2023-02-27 Pages: 6
Assignors
HWANG, SEHYUN
Executed: 2023-01-16
LEE, JONGMIN
Executed: 2023-01-16
SHIN, JOONWON
Executed: 2023-01-16
CHOI, JIMIN
Executed: 2023-01-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Chip and Semiconductor Package Including the Same
Application: 18/174,865 →
Publication: US 2024/0069093
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Inventor Name Previously Recorded on Reel 62809 Frame 328. Assignor(S) Hereby Confirms the Assignment. Mar 23, 2026
From: HWANG, SEHYUN; LEE, JONGMIN; SHIN, JOONGWON; CHOI, JIMIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 075219/0294 →