Patent Assignment
Reel/Frame 075219/0294
Corrective Assignment to Correct the Inventor Name Previously Recorded on Reel 62809 Frame 328. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2026-03-23
Pages: 7
Assignors
HWANG, SEHYUN
Executed: 2023-01-16
LEE, JONGMIN
Executed: 2023-01-16
SHIN, JOONGWON
Executed: 2023-01-16
CHOI, JIMIN
Executed: 2023-01-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.