IP Library › Assignment 063038/0447
Patent Assignment
Reel/Frame 063038/0447

Assignment of Assignor's Interest

Recorded: 2023-03-20 Pages: 8
Assignors
HUANG, CHUN-CHIEH
Executed: 2021-02-25
LIU, CHIN-MING
Executed: 2021-02-26
Assignees
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18-2 TENGFEI ROAD,ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE, QINHUANGDAO, CHINA
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
SL11, NO.8, LANGDONG ROAD, YANCHUAN COMMUNITY,,YANLUO STREET, BAO 'AN DISTRICT, SHENZHEN CITY, SHENZHEN, CHINA
Covered Property (1)
Packaged Circuit Structure
Application: 18/123,881 →
Publication: US 2023/0232537
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 22, 2024
From: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
Reel/Frame 066191/0851 →