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Patent Assignment
Reel/Frame 066191/0851

Assignment of Assignor's Interest

Recorded: 2024-01-22 Pages: 5
Assignors
Assignees
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18-2 TENGFEI ROAD,ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE, QINHUANGDAO, CHINA
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
SL11, NO.8, LANGDONG ROAD, YANCHUAN COMMUNITY,,YANLUO STREET, BAO 'AN DISTRICT, SHENZHEN CITY, SHENZHEN, CHINA
Covered Property (1)
Packaged Circuit Structure
Application: 18/123,881 →
Publication: US 2023/0232537
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 20, 2023
From: HUANG, CHUN-CHIEH; LIU, CHIN-MING
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.; QI DING TECHNOLOGY QINHUANGDAO CO., LTD.; LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.
Reel/Frame 063038/0447 →